Master Bond EP21TP-2NV is a two part epoxy polysulfide formulated for use as an adhesive, sealant and potting system.
It withstands prolonged exposure to many harsh chemicals including fuels, oils, hydrocarbons and hydraulic fluids.
It is also fully RoHS compliant, meeting RoHS3 Directive (EU) 2015/863.

Featuring a combination of thermal conductivity and electrical insulation properties, Master Bond Supreme 3CCM-85 is a new single component epoxy
initially designed for glob top and chip coating applications.
However, this system can also be utilized for encapsulation and bonding. Supreme 3CCM-85 cures within 2-3 hours at 175-185°F [80-85°C],

Two component epoxy, Master Bond EP88FL, is a highly flexible, optically clear compound formulated for bonding, coating, sealing, potting and encapsulation.
It is easy to use, with a mixing ratio of one to one by weight or volume.

Master Bond Supreme 17HT is a single component, no mix epoxy system for bonding and sealing applications featuring an unlimited working life at room temperature. “This thermally stable formulation has a high glass transition temperature of 410°F (210°C) and retains its bond strength at elevated temperatures,” says Rohit Ramnath, senior product engineer.

Master Bond UV22DC80-1Med is a single component, nanosilica filled compound featuring a UV and heat curing mechanism.
Not only does it pass USP Class VI tests for biocompatibility, but it also meets ISO 10993-5 for cytotoxicity,
making it ideal for many applications in the medical device industry.

Master Bond EP30NG is a two part epoxy adhesive system developed for applications that require high thermal conductivity.
It contains a specialty graphene filler which contributes not only to its high compressive strength, but also to its enhanced dimensional stability.

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