Master Bond Supreme 11AOHTLP is a two component epoxy featuring thermal conductivity and electrical insulation.
This system is specifically designed for bonding larger parts since it has a relatively long working life of 60-90 minutes
(at room temperature for a 100-gram batch). This makes it uniquely suited for demanding situations where more time for fixturing is needed.
Master Bond UV15DC80-1Med offers a unique dual cure mechanism utilizing UV light for initial fixation followed by heat for complete polymerization.
This addresses limitations of traditional UV adhesives by effectively curing shadowed areas that wouldn't receive sufficient UV exposure,
Master Bond MasterSil 323S-LO is an addition cured silicone that is not only electrically conductive,
but also thermally conductive. This ASTM E-595 low outgassing rated product is designed for bonding applications where low stress is critical and is appropriate for use in vacuum environments. It can be utilized in the aerospace, electronic, opto-electronic, and specialty OEM industries.
Master Bond EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that can be effectively utilized
for underfill, coating, impregnating and porosity sealing applications. This optically clear compound features high dimensional
Master Bond UV15RCL is a low viscosity, cationic type UV curing system with a special color changing feature.
The originally red material changes to clear once exposed to UV light, indicating that there is UV light access across the adhesive material.
Master Bond Supreme 11AOHTMed is a two component epoxy featuring thermal conductivity and electrical insulation.
This system fully passes ISO 10993-5 testing for non-cytotoxicity and is recommended for bonding and sealing in medical device applications.