Silver filled epoxy adhesive system Master Bond EP3HTSDA-2 was developed for crucial thermal management applications.
As a one component system, it is not premixed and frozen and has an “unlimited” working life at room temperature.
This compound possesses a high thermal conductivity of 45-49 BTU•in/ft2•hr•°F [6.5-7.0 W/(m•K)].

Master Bond EP30NS is a two component epoxy system that cures at room temperature or more rapidly at elevated temperatures.
It is optically clear especially in thin sections and can be used as an adhesive, sealant, coating and encapsulation compound.

Formulated for medical electronic applications, Master Bond EP62-1LPSPMed is a biocompatible two part epoxy that has a mixed viscosity of 150-300 cps.
Its ultra low viscosity makes it ideal for use in underfill, impregnation and porosity sealing applications, while it also performs well in bonding, coating or encapsulation.

Master Bond is pleased to announce that the following epoxy compounds, EP17HTDA-1, EP21TDCHT, EP33, EP46HT-1AO, Supreme 11AOHT and Supreme 12AOHT-LO
have passed MIL-STD-883J section 3.5.2., the subsection of the United States Military Standards set by the U.S. Department of Defense

Master Bond MasterSil 170 Gel is a two component system with excellent flowability for potting and encapsulation applications.
It possesses a low mixed viscosity of 1,000 cps, has a long working life after mixing (2-4 hours for 100 g batch), a low exotherm upon cure and is easy to dispense.

Master Bond EP42HT-3AO is a two component, moderate viscosity epoxy system with good flow properties. It is ideal for small to moderate size encapsulating, potting and casting applications.
It is also effective in bonding fragile components requiring a low coefficient of thermal expansion.