Master Bond EP21NS is a two part epoxy that may be used for bonding, coating, sealing and potting/encapsulating. It has a nanosilica filler that imparts dimensional stability and abrasion resistance.
When measured according to ASTM D4060, standard test method for abrasion resistance, with CS-17 wheel for 1,000 cycles, EP21NS exhibits a very low weight loss of 25 mg.

Master Bond UV15X-6Med-2LV is a UV curable, non-cytotoxic adhesive that features optical clarity and abrasion resistance.
Not only can it be utilized for bonding, but it can also be employed for sealing, coating, and encapsulating purposes.

Master Bond EP4EN-80 is a NASA low outgassing approved epoxy, which can cure at temperatures as low as 80°C, unlike conventional one component heat curing systems.
It features a quick cure profile at 65°C for 90 minutes plus 30 minutes at 80-85°C. The epoxy system requires no mixing prior to use, has a very low viscosity of 600-1,800 cps and contains no solvents.

Master Bond MasterSil 151S is an addition curing two part silicone system that may be used as an adhesive, sealant, coating or form-in-place gasketing material.
A unique feature of this product is that despite its silicone chemistry, it passes NASA low outgassing specifications.

Master Bond EP21ARLV is a two part epoxy that may be used as an adhesive, sealant, coating or encapsulant.
The product is capable of withstanding prolonged exposure to a wide range of chemicals, such as 70% sulfuric acid, 10% hydrochloric acid, 10% nitric acid and butyl acetate to name a few.

Master Bond EP29LPAOHT is a two component, NASA low outgassing approved epoxy system featuring a long working life of 8-10 hours per 1,000 gram batch.
Due to its low exotherm and flowable consistency, this product is suitable for specialty potting applications where large masses of the epoxy need to be cured.

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