Two component, optically clear, nanosilica filled epoxy for potting, encapsulating, coating and sealing
- Low viscosity and very long open time
- Exceptionally low shrinkage upon curing
- Superior dimensional stability
- High temperature resistance
- Passes NASA low outgassing
- Withstands 1,000 hours 85°C/85% RH
Master Bond EP114 is a two component, nanosilica filled epoxy system for potting, coating and sealing. The addition of the nano particles enhances the dimensional stability and the already exceptionally low shrinkage upon curing. EP114 has a 100 to 80 mix ratio by weight. It has an unusually low viscosity along with an especially long open time of 2-4 days. It should be noted that EP114 requires oven curing. A typical cure schedule is 2-3 hours at 250°F followed by 5-8 hours at 300°F with a 2 hour or longer post cure at 350°F, although, a number of variations are possible.
EP114 is a top tier electrical insulator. It bonds well to a wide variety of substrates including metals, composites, glass, ceramics and plastics. As a toughened system, it has good resistance to thermal cycling and shock. When the aforementioned properties are combined with its pronounced low viscosity, it is a highly attractive candidate for potting and encapsulating. Some other positive features include its excellent physical strength profile as well as its chemical resistance to water, oils, acids, bases and fuels. The service temperature range is -100°F to +550°F. EP114 is a versatile, specialty type system that can be used in many different aerospace, electronic and OEM applications where this uncommon blend of product properties is desirable.
- Low viscosity
- Extraordinarily long open time
- Can withstand rigorous thermal cycling
- Marvelous electrical insulation properties
- First rate physical properties
EP114 is available is various sizes and units to accommodate customer's needs.