Epoxy Adhesive Systems

An extensive line of one and two component epoxy adhesives, sealants, coatings, potting/encapsulation compounds and impregnation resins are available for use. Two part systems can be cured at room temperature or at elevated temperatures. One part systems can be cured at elevated temperatures only (typically 250-300°F).
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  • One Part Epoxy Systems: require no mixing and are available in liquid, paste and solid forms. They are designed to simplify processing, eliminate waste, and accelerate productivity, while alleviating concerns regarding mix ratios, weighing, working life and shelf life.
  • B-Stage Epoxy Systems: a unique one part system that is in a partially cured stage.
  • Two Part Epoxy Systems: include the majority of industrial grade adhesives and offer the broadest array of performance properties. With specialty packaging options, they ease processing concerns about mixing, weighing and storing.

Applications of Master Bond Epoxies

Master Bond epoxy compounds are designed to withstand exposure to hostile environmental conditions. They are employed in aerospace, automotive, optical, medical, oil/chemical processing, electronics and other industries. Master Bond products can be formulated to meet specific application requirements.

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