The unique requirements of microelectromechanical systems (MEMS) call for specialized materials. Versatile epoxy adhesives are often capable of providing the necessary properties to ensure support and protection from thermal and mechanical shock, vibration, high acceleration, particles, and other physical damage. Improved capabilities have enhanced the advantages of using these systems for die attach, underfill and encapsulation to meet demanding MEMS packaging requirements. This white paper will focus on how these materials are used and their benefits for MEMs applications.


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