Master Bond Inc. of Hackensack, New Jersey has developed EP24, new fast curing, two component epoxy adhesive. This high performance system cures at room temperature or more rapidly at elevated temperatures. Additionally, it will cure at colder temperatures, down to 20°F. It is easy to use and has a convenient non critical mix ratio of 1 to 1 by weight or volume.
A unique two component, room temperature curing, high temperature resistant epoxy adhesive called EP35 has been introduced by Master Bond Inc., Hackensack, N.J. This system produces high strength bonds whose strength is maintained even after long exposures to temperatures in the 450°F-500°F range.
Master Bond EP21AO is a two component, thermally conductive, electrically isolating epoxy adhesive with a forgiving 1 to 1 mix ratio by weight or volume. Developed by Master Bond Inc., Hackensack, N.J. this compound is extremely versatile and will adhere well to variety of similar and dissimilar substrates.
Master Bond EP51FL is a new two component, highly flexible epoxy resin system developed by Master Bond Inc., Hackensack, N.J. for high performance bonding. EP51FL has a 1 to 1 mix ratio, weight or volume. It cures rapidly at room temperature and has a setup time of 30-40 minutes. Cure speeds can be accelerated by the use of heat.
A new room temperature curing, aluminum filled two component epoxy adhesive called EP22 has been introduced by Master Bond Inc. Hackensack N.J. This system has an easy to use one to one mix ratio by weight or volume. It produces durable high strength and tough bonds with outstanding adhesion to metals, particularly steel and aluminum.
Master Bond Inc. of Hackensack, New Jersey has developed a new two component epoxy system for service above 500°F. Called EP125, this compound is designed to withstand exposure to boiling acids, alkalis, salts, fuels and most organic solvents. It offers high bond strength to metallic and nonmetallic surfaces.