One Component, Toughened Epoxy System Cures at 185°F.
Two component, quartz filled epoxy system for bonding, sealing and casting features high temperature resistance and withstands abrasion
Two part silicone for high performance casting, potting & encapsulation and sealing
Two Component, Thermally Conductive, Room Temperature Curable, Heat Resistant Epoxy Adhesive, Sealant, Coating & Casting System. Ideal for Potting and Encapsulation.
One component epoxy for bonding and underfill applications, minimum curing temperature 80°C
One component epoxy for bonding and small encapsulation applications, minimum curing temperature 80°C. Thermally conductive, electrically insulating.
One component toughened epoxy for bonding and sealing
Two component, silver filled silicone with superb electrical conductivity along with good heat transfer properties.
Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System Featuring Outstanding Heat, Chemical and Steam Resistance for Medical Device Manufacturing.
One part die attach epoxy has high temperature resistance and electrical conductivity.