Master Bond Inc.
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WHITE PAPER SPOTLIGHT
Master Bond White Paper
Understanding How Die Attach Adhesives Impact Product Quality
Die attach adhesives offer vital performance properties to improve electronic manufacturing, including semiconductor assembly. Some of these properties consist of thin bond lines, high strength characteristics and overall long-term reliability. Learn more about the important properties of die attach adhesive in this white paper.
Our Top Performing Die Attach Compounds
Master Bond EP17HTDA-1
EP17HTDA-1
Thermally conductive, electrically insulative system with high Tg
Master Bond EP3HTS-TC
EP3HTS-TC
Electrically conductive adhesive with extremely high thermal conductivity
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