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WHITE PAPER SPOTLIGHT
Master Bond White Paper
Adhesive Compounds Play Key Role in Sensor Fabrication Performance
By utilizing specific filler materials, adhesive compounds can be formulated with an ideal combination of performance properties including electrical or thermal conductivity, chemical resistance, and stability as well as processing characteristics like viscosity, working life and curing time. Learn more about the fundamental role that these adhesives and their performance properties play in the success of diverse sensor devices.
Our Top Performing Adhesives for Sensor Applications
Master Bond EP30HT
EP30HT
Optically clear, structural adhesive with high temperature resistance
Master Bond EP5G-80
EP5G-80
One part, graphite filled epoxy with a curing temperature of 80°C
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