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UV22DC80-10F: Nanosilica Filled, Dual Cure System |
Master Bond UV22DC80-10F is a single component, high performance adhesive that will cure upon exposure to UV light and/or the addition of heat. Its secondary heat curing mechanism will complete cure at 80°C and is designed for use in shadowed out areas. UV22DC80-10F is frequently used to bond heat sensitive substrates because of its low heat cure temperature. Most noteworthy is its low shrinkage upon curing, reliable dimensional stability and NASA low outgassing certification.
For more information, request a data sheet on UV22DC80-10F |
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EP42HT-3AO: Room Temperature Curable Epoxy Adhesive |
Master Bond EP42HT-3AO is a thermally conductive, electrically insulating epoxy that offers a high glass transition temperature and a low coefficient of thermal expansion. Upon mixing, it has a moderate viscosity with very good flow properties. It bonds well to a wide variety of substrates including metals, composites, ceramics, glass and many plastics.
For more information, request a data sheet on EP42HT-3AO |
| EP3HTSDA-2: One Part, Electrically and Thermally Conductive Epoxy |
Silver filled EP3HTSDA-2 delivers incredibly low thermal resistance of 2-3 x 10-6 K•m2/W. As a one part system, EP3HTSDA-2 is easy to handle and dispenses readily and smoothly. It cures quickly at 250-300°F and offers superior physical strength properties including relatively high tensile lap shear strength.
For more information, request a data sheet on EP3HTSDA-2 |
| EP62-1LPSPMed: Toughened Epoxy for Bonding, Sealing, Coating, Encapsulating and Impregnation |
Featuring an ultra low viscosity, Master Bond EP62-1LPSPMed is a two part epoxy system that passes USP Class VI and ISO 10993-5 requirements for biocompatibility. It is serviceable from 4K to +400°F and offers superior resistance to EtO, radiation, chemical sterilization and autoclaving. It can be used for both reusable and disposable medical devices.
For more information, request a data sheet on EP62-1LPSPMed |
| EP30LTE-2: Epoxy Offers Low Coefficient of Thermal Expansion |
Master Bond EP30LTE-2 features excellent dimensional stability as well as low linear and volumetric shrinkage upon curing. It has a forgiving 100 to 5 mix ratio by weight and cures readily at room temperature or more quickly at elevated temperatures. This NASA low outgassing approved system bonds well to a wide variety of substrates while maintaining excellent chemical resistance properties.
For more information, request a data sheet on EP30LTE-2 |
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Copyright  2018 by Master Bond Inc. All Rights Reserved. This content may not be reproduced in any way without the prior written permission of Master Bond Inc.
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December 2018
