Product: 
EP62-1LPSP

Release Date: 
01/26/2015

Master Bond EP62-1LPSP delivers an array of strength, electrical and handling properties that are well suited for bonding, sealing, coating and encapsulation applications. With a tensile lap shear strength exceeding 2,000 psi, it bonds well to a variety of substrates including metals, composites, glass and many plastics.

This optically clear epoxy has a non-critical four to one mix ratio by weight and features an open time of 12-24 hours at ambient temperatures. EP62-1LPSP has a thin mixed viscosity of 150-300 cps, which can be further lowered by adding heat. Its low exotherm while curing allows it to be used for large encapsulations. It offers a variety of cure schedules and can be cured at temperatures as low as 60-70°C. Faster cures can be achieved at 125°C.

Featuring a glass transition temperature of greater than 125°C, EP62-1LPSP is a thermally stable system that is serviceable over the wide temperature range of -60°F to +400°F. It withstands exposure to chemicals such as water, fuels, oils, solvents, acids and bases. EP62-1LPSP is a reliable electrical insulator and has a volume resistivity over 1014 ohm-cm. This blend of high performance properties allows this product to be used in aerospace, electronic, fiber-optic, optoelectronic and specialty OEM applications.

EP62-1LPSP is available for use in standard ½ pint, pint, quart, gallon and 5 gallon kit containers. It can be applied by brush, paint roller, syringe or gun dispenser.

For Editorial Use

Click below to download this release in the format of your choice.

AttachmentSize
Microsoft Office document icon EP62-1LPSP_nr.doc27 KB
HTML icon EP62-1LPSP_nr.html3.91 KB
Plain text icon EP62-1LPSP_nr.txt3.03 KB

News Release Images

Click an image to download a high resolution version in JPEG format.

image/jpeg 788 KB